Title :
An automated noise measurement system for packaged VLSI metal thin films
Author :
Gutt, G.M. ; Cottle, J.G.
Author_Institution :
South Florida Univ., Tampa, FL, USA
Abstract :
An approach to automating the noise measurement procedure for packaged VLSI metal films is described. The automation of noise measurements required that compromises be made with the traditional noise measurement system. Relays are used in place of many of the soldered interconnections of the traditional system. Heating of the metal films is accomplished through use of a several `hot chucks´. The hot chucks used are high-power resistors that easily dissipate heat when DC current is supplied. A piezoelectric vibration detection system was designed and fabricated to monitor seismic occurrences during the measurement process. To control the automated measurement system a script language referred to as ANIMAL (automated noise measurement language) is being written to control the system through a series of stored commands
Keywords :
VLSI; computerised instrumentation; electric noise measurement; metallic thin films; metallisation; ANIMAL; automated noise measurement language; automated noise measurement system; film heating; high-power resistors; hot chucks; packaged VLSI metal thin films; piezoelectric vibration detection system; relays; script language; seismic occurrences; Automatic control; Automation; Control systems; Heating; Noise measurement; Packaging; Relays; Seismic measurements; Very large scale integration; Vibration measurement;
Conference_Titel :
Southeastcon '89. Proceedings. Energy and Information Technologies in the Southeast., IEEE
Conference_Location :
Columbia, SC
DOI :
10.1109/SECON.1989.132633