• DocumentCode
    3333590
  • Title

    Improved transmission line model for input impedance of rectangular microstrip antennas with multi-dielectric layers

  • Author

    Shunshi Zhong ; Gang Lin ; Stassevich, V.

  • Author_Institution
    Shanghai Univ. of Sci. & Technol., China
  • Volume
    1
  • fYear
    1994
  • fDate
    20-24 June 1994
  • Firstpage
    492
  • Abstract
    A number of investigations have been carried out to determine the electrical characteristics of microstrip antennas with multi-dielectric layers using spectral domain analysis and other full-wave analysis methods. However, the accurate numerical methods are time-consuming and are not easily included in a CAD package. The transmission line models (TLM) are still the fastest models used to analyze rectangular microstrip antennas. A new improved TLM is presented which refines the original approximations and extends them to the more general configurations with multi-dielectric layers. The improvements of the present model are due mainly to two techniques. First, a lossy TLM is introduced with an attenuation constant /spl alpha/ taking account of all of the losses (dielectric, conductive, radiation and surface wave losses). Secondly, the multi-dielectric layer rectangular microstrip antenna is treated as a multi-layer microstrip line, which is equivalent to a normal microstrip line on one substrate by means of the conformal mapping approach.<>
  • Keywords
    electric impedance; losses; microstrip antennas; microstrip lines; spectral-domain analysis; transmission line theory; TLM; approximations; attenuation constant; conductive loss; conformal mapping approach; dielectric loss; electrical characteristics; full-wave analysis methods; input impedance; lossy TLM; multi-dielectric layers; multi-layer microstrip line; radiation loss; rectangular microstrip antennas; spectral domain analysis; substrate; surface wave loss; transmission line model; Attenuation; Dielectric losses; Dielectric substrates; Electric variables; Impedance; Microstrip antennas; Packaging; Spectral analysis; Transmission line antennas; Transmission lines;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Antennas and Propagation Society International Symposium, 1994. AP-S. Digest
  • Conference_Location
    Seattle, WA, USA
  • Print_ISBN
    0-7803-2009-3
  • Type

    conf

  • DOI
    10.1109/APS.1994.407706
  • Filename
    407706