• DocumentCode
    3333861
  • Title

    A ±9 V fully integrated CMOS electrode driver for high-impedance microstimulation

  • Author

    Ethier, Sébastien ; Sawan, Mohamad ; Aboulhamid, El Mostapha ; El-Gamal, Mourad

  • Author_Institution
    Dept. of Electr. Eng., Ecole Polytech., Montreal, QC, Canada
  • fYear
    2009
  • fDate
    2-5 Aug. 2009
  • Firstpage
    192
  • Lastpage
    195
  • Abstract
    A high-voltage electrode driver dedicated to intracortical microstimulation is presented. It is intended to significantly increase the voltage swing in order to maintain constant current stimulation through high-impedance electrode-tissue contacts. Charge pumps are used to generate high-voltage supplies of 8.615 V and -8.348 V from 3.3 V with low ripples (less than 1.6 %) while driving a maximal stimulation current of 200 muA. The negative charge pump architecture has been carefully implemented to suppress latch-up triggering. This high-voltage system is fully integrated and has been implemented with the C08E CMOS 0.8 mum 5 V/20 V process from DALSA Semiconductor. The final output voltage compliance is 14.82 V, allowing constant current stimulation for an implantable in-vivo prototype.
  • Keywords
    CMOS integrated circuits; bioelectric phenomena; biological tissues; biomedical electrodes; biomedical electronics; charge pump circuits; microelectrodes; DALSA semiconductor; constant current stimulation; current 200 muA; high-impedance electrode-tissue contact; high-impedance microstimulation; implantable in-vivo prototype; integrated CMOS electrode driver; intracortical microstimulation; latch-up triggering; negative charge pump architecture; size 0.8 mum; voltage -8.348 V; voltage 14.82 V; voltage 20 V; voltage 3.3 V; voltage 5 V; voltage 8.615 V; CMOS process; CMOS technology; Electrodes; Energy consumption; Impedance; Integrated circuit technology; Microelectrodes; Power generation; Prototypes; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems, 2009. MWSCAS '09. 52nd IEEE International Midwest Symposium on
  • Conference_Location
    Cancun
  • ISSN
    1548-3746
  • Print_ISBN
    978-1-4244-4479-3
  • Electronic_ISBN
    1548-3746
  • Type

    conf

  • DOI
    10.1109/MWSCAS.2009.5236121
  • Filename
    5236121