• DocumentCode
    333417
  • Title

    Study on electro-bactericidal effect of the metal coating flat sheet membrane for Pseudomonas aeruginosa

  • Author

    Sugawara, T. ; Kimura, K. ; Misawa, K. ; Arisawa, J. ; Igarashi, O.

  • Author_Institution
    Dept. of Appl. Electron., Hokkaido Inst. of Technol., Sapporo, Japan
  • Volume
    2
  • fYear
    1998
  • fDate
    29 Oct-1 Nov 1998
  • Firstpage
    1068
  • Abstract
    A newly designated metal coating flat sheet membrane was examined for bactericidal activity using Pseudomonas aeruginosa which was recognized as a pathogen to opportunistic infection in hospitals. After the bacteria were artificially trapped into the membrane, an electric current was passed through the surface of the membrane. More than 90% of bacteria were reduced by the passing electric current, comparing with non-electric current control. The kinds of electric current were also tested for their bactericidal activities. Both direct current (DC) and alternating current (50 Hz AC) showed same bactericidal activity for Pseudomonas aeruginosa. Furthermore, steam was observed when an electric current was applied. From these observations, we considered that the application of DC or 50 Hz AC electric current to the metal coating flat sheet membrane could sterilize bacteria which was mechanically trapped, due to heat generation with electric current application
  • Keywords
    biocontrol; bioelectric phenomena; biological techniques; membranes; microorganisms; AC electric current; DC electric current; Pseudomonas aeruginosa; artificially trapped bacteria; bacterial control system; bactericidal activity; electro-bactericidal effect; metal coating flat sheet membrane; pathogen to opportunistic infection; sterilization; Biomembranes; Coatings; Current; Electronics industry; Electrons; Hospitals; Industrial electronics; Metals industry; Microorganisms; Pathogens;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society, 1998. Proceedings of the 20th Annual International Conference of the IEEE
  • Conference_Location
    Hong Kong
  • ISSN
    1094-687X
  • Print_ISBN
    0-7803-5164-9
  • Type

    conf

  • DOI
    10.1109/IEMBS.1998.745637
  • Filename
    745637