DocumentCode
3334172
Title
Frozen water for MEMS fabrication and packaging applications
Author
Li, Sha ; Pan, Wei ; Lin, Liwei
Author_Institution
Dept. of Mech. Eng., California Univ., Berkeley, CA, USA
fYear
2003
fDate
19-23 Jan. 2003
Firstpage
650
Lastpage
653
Abstract
A frozen water process, which is clean, low temperature and biocompatible, is successfully demonstrated. The working principle is based on that frozen water can be processed as a solid thin film before it melts. In order to pattern the frozen water, hydrophobic and hydrophilic regions should be defined to allow water to be selectively attached to the hydrophilic area under the ambient environment. After water is frozen, a polymer layer can be spun on top of this solid layer to form the final structure. The frozen water can melt and evaporate gradually afterwards and function as the sacrificial layer. This frozen water process can also serve as a packaging procedure to encapsulate working liquids with an impermeable layer over the polymer. Two possible applications are envisioned and realized, including capillary-driven micropumps and micro optical lenses. Experimental results show that micropumps have flow rate from about 3nL/min at the beginning and reduce to about 0.2nL/min after 10 minutes with microchannel widths of 20 to 40 μm. The fabricated microlenses have measured focal lengths from 433 μm to 5660 μm when the frozen water patterns are from 500 μm to 2000 μm.
Keywords
ice; microlenses; micromechanical devices; micropumps; packaging; polymer films; 10 min; 20 to 40 micron; 433 to 5660 micron; 500 to 2000 micron; H2O; MEMS fabrication; capillary-driven micropumps; frozen water; micro optical lenses; microlenses; packaging; polymer layer; Biomedical optical imaging; Fabrication; Lenses; Liquids; Micromechanical devices; Micropumps; Packaging; Polymer films; Solids; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro Electro Mechanical Systems, 2003. MEMS-03 Kyoto. IEEE The Sixteenth Annual International Conference on
ISSN
1084-6999
Print_ISBN
0-7803-7744-3
Type
conf
DOI
10.1109/MEMSYS.2003.1189833
Filename
1189833
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