• DocumentCode
    3334293
  • Title

    Mechanical properties of compressively prestressed thin films extracted from pressure dependent ripple profiles of long membranes

  • Author

    Kramer, Torsten ; Paul, Oliver

  • Author_Institution
    Inst. for Microsystem Technol., Freiburg Univ., Germany
  • fYear
    2003
  • fDate
    19-23 Jan. 2003
  • Firstpage
    678
  • Lastpage
    681
  • Abstract
    We report the determination of mechanical properties of compressively prestressed thin films from the postbuckling behavior of long rectangular membranes under differential pressure. Such structures show buckling profiles with ripples of pressure-dependent wavelength λ and amplitude Δw. At sufficiently high loads they undergo a symmetry transition to a ripple-free deflection profile. A model based on the energy minimization method (EMM) was developed to describe the mechanical behavior of these compressively prestressed membranes. For this purpose a new set of trial functions was constructed enabling the complex behavior including the symmetry transition to be described. Values for Young´s modulus E and the prestrain ε0 can be extracted from the comparison of experimental load-deflection data and EMM simulations. The model was applied to ripple data of a PECVD silicon nitride. Young´s modulus and the prestrain were found to be E=160 GPa and ε0=-7.0×10-4 respectively.
  • Keywords
    Young´s modulus; buckling; insulating thin films; micromechanical devices; silicon compounds; tensile strength; PECVD Si3N4; Si3N4; Young´s modulus; compressively prestressed thin films; energy minimization method; long membranes; mechanical properties; postbuckling behavior; pressure dependent ripple profiles; ripple-free deflection profile; symmetry transition; trial functions; Biomembranes; Etching; Frequency; Laboratories; Mechanical factors; Micromechanical devices; Minimization methods; Silicon compounds; Stress; Transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems, 2003. MEMS-03 Kyoto. IEEE The Sixteenth Annual International Conference on
  • ISSN
    1084-6999
  • Print_ISBN
    0-7803-7744-3
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2003.1189840
  • Filename
    1189840