DocumentCode
3334307
Title
Microneedle arrays fabricated using suspended etch mask technology combined with fluidic through wafer vias
Author
Trautmann, A. ; Ruther, Patrick ; Paul, Oliver
Author_Institution
Inst. for Microsystem Technol., Freiburg Univ., Germany
fYear
2003
fDate
19-23 Jan. 2003
Firstpage
682
Lastpage
685
Abstract
We report the fabrication and characterization of microneedle arrays combined with (i) reservoirs for therapeutic or analytic fluids, (ii) sharp edges suitable as cutting and flaring features to increase skin permeability, and (iii) fluidic through wafer connections. Microneedle fabrication relies on a new approach combining deep reactive ion etching of silicon with suspended etch masks. This fabrication technology applies an etch mask which remains suspended above an etch cavity containing microneedle arrays and reservoirs. The structures are intended to enable painless transdermal drug delivery, e.g., application of allergen solutions in allergy diagnostics (Prick test) or of vaccines.
Keywords
biomedical equipment; drug delivery systems; microfluidics; micromechanical devices; sputter etching; Prick test; allergen solutions; allergy diagnostics; characterization; cutting; deep reactive ion etching; fabrication; flaring; fluidic through wafer vias; increase skin permeability; microneedle arrays; sharp edges; suspended etch mask technology; suspended etch masks; vaccines; wafer connections; Drug delivery; Etching; Fabrication; Permeability; Pharmaceutical technology; Reservoirs; Silicon; Skin; Testing; Vaccines;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro Electro Mechanical Systems, 2003. MEMS-03 Kyoto. IEEE The Sixteenth Annual International Conference on
ISSN
1084-6999
Print_ISBN
0-7803-7744-3
Type
conf
DOI
10.1109/MEMSYS.2003.1189841
Filename
1189841
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