• DocumentCode
    3334453
  • Title

    Thermopower investigation of a-As2Se3

  • Author

    Chiu, Dirk M.

  • Author_Institution
    Dept. of Electr. & Electron. Eng., Victoria Univ. of Technol., Melbourne, Vic., Australia
  • fYear
    1997
  • fDate
    27 Jul-1 Aug 1997
  • Firstpage
    1086
  • Abstract
    Thermopower and electrical conductivity experiments indicate that a-As2Se3 favours unipolar (holes) conduction. The ratio of electron to hole mobilities is found to be about 0.04 which is considered as relatively small. Photoconductivity measurement further confirms the concept and assumption for the involvement of hopping energy, and an activated mobility is observed in the high temperature, mono-molecular regime. A two level discrete trapping model analysis reveals that localized to localized traps recombination predominates the conduction process, and the Fermi level is found to be pinned in the middle of the mobility gap
  • Keywords
    Fermi level; arsenic compounds; chalcogenide glasses; electrical conductivity; electrical conductivity measurement; electron mobility; electron traps; electron-hole recombination; hole mobility; hole traps; hopping conduction; photoconductivity; semiconductor thin films; small polaron conduction; sputtered coatings; thermoelectric conversion; thermoelectric power; As2Se3; Fermi level; a-As2Se3; activated mobility; conduction process; electrical conductivity; holes conduction; hopping energy; localized traps recombination; mobility gap; photoconductivity measurement; thermopower; two level discrete trapping model; unipolar conduction; Amorphous materials; Charge carrier processes; Conducting materials; Conductivity; Crystallization; Electrodes; Light emitting diodes; Photoconductivity; Sputtering; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Energy Conversion Engineering Conference, 1997. IECEC-97., Proceedings of the 32nd Intersociety
  • Conference_Location
    Honolulu, HI
  • Print_ISBN
    0-7803-4515-0
  • Type

    conf

  • DOI
    10.1109/IECEC.1997.661921
  • Filename
    661921