DocumentCode
3334568
Title
System-in-a-package technology for 3D integration of radar modules
Author
Brebels, S. ; Sun, X. ; Carchon, G. ; Posada, G. ; Dussopt, L. ; Dubois, M.A. ; Vandenbosch, G. ; De Raedt, W.
Author_Institution
HRFP Group, IMEC, Leuven
fYear
2008
fDate
22-24 Sept. 2008
Firstpage
112
Lastpage
115
Abstract
3D thin-film technology including substrate vias and integrated passives is used as a platform for heterogeneous integration of high frequency wireless systems and radar. The features of the technology are first described and next demonstrated with an integrated Doppler radar operating in the Ku band.
Keywords
Doppler radar; microwave integrated circuits; system-in-package; 3D thin-film technology; Ku band operation; high frequency wireless system integration; integrated Doppler radar; system-in-a-package technology; Doppler radar; Glass; Integrated circuit interconnections; Integrated circuit technology; Packaging; Passive radar; Radio frequency; Substrates; Thin film circuits; Transistors;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwaves, Radar and Remote Sensing Symposium, 2008. MRRS 2008
Conference_Location
Kiev
Print_ISBN
978-1-4244-2688-1
Electronic_ISBN
978-1-4244-2689-8
Type
conf
DOI
10.1109/MRRS.2008.4669558
Filename
4669558
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