Pulsed stress behavior of platinum thin films

Author

Bonfert, Detlef ; Gieser, Horst ; Bock, Karlheinz ; Svasta, Paul ; Ionescu, Ciprian

Author_Institution

Polytronic Syst., Fraunhofer EMFT, Munich, Germany

fYear

2010

fDate

23-26 Sept. 2010

Firstpage

83

Lastpage

88

Abstract

Platinum thin film layer´s long-term stability, repeatability, fast response time, and wide temperature range make it a useful choice in many applications. As a result, platinum resistance temperature devices (RTD) are known as the most reliable standard available for temperature measurements. In this paper we focus on the pulsed stress behavior of the platinum thin film layer, used as a conductive layer for heating and temperature sensing and the stability of the resistive properties. During pulsing, in situ monitoring of temperature generation was possible.

Keywords

electrical resistivity; metallic thin films; platinum; temperature sensors; thin film sensors; DC resistance measurement; Pt; conductive layer; heating; in situ monitoring; platinum thin film layer; pulsed stress behavior; resistance temperature devices; temperature generation; temperature sensing; Current measurement; Electrical resistance measurement; Platinum; Pulse measurements; Resistance; Temperature measurement; Voltage measurement; Electrostatic Discharge (ESD); Platinum thin film layer; Pulsed stress; Transmission Line Pulsing (TLP); resistance temperature device (RTD);

fLanguage

English

Publisher

ieee

Conference_Titel

Design and Technology in Electronic Packaging (SIITME), 2010 IEEE 16th International Symposium for

Conference_Location

Pitesti

Print_ISBN

978-1-4244-8123-1

Type

conf

DOI

10.1109/SIITME.2010.5651534

Filename

5651534