Title :
Comparison of methods in approximation of blood flow in finite element models on temperature profile during RF ablation
Author :
Min, Xiaoyi ; Mehra, Rahul
Author_Institution :
Medtronic Inc., Minneapolis, MN, USA
fDate :
29 Oct-1 Nov 1998
Abstract :
The difficulties in controlling factors that affect lesion size in vitro and in vivo suggest that a theoretical approach may be advantageous. Due to complexities in describing flow velocity field in the equations, heat lost to convection due to blood flow was approximated by film boundary condition at blood/tissue and blood/electrode interfaces in the existing models in literature. Experimental data has shown that the temperature distribution is sensitive to convection. However, no modeling work has been reported on either alternative approaches or the impact of film boundary condition on temperature distribution. Here, the authors introduce body flux for convection in blood and compare the results with film boundary condition and with no convection. After 60 seconds of 10 W RF energy delivery, lesion size remains almost the same by using either body flux or film boundary condition. However, the difference in maximum temperature in tissue and electrode temperature may have implication in temperature controlled RF ablation. The maximum temperature in tissue varies from the surface of electrode into one millimeter deep in tissue due to convection
Keywords :
cardiology; convection; finite element analysis; haemodynamics; patient treatment; physiological models; temperature distribution; 10 W; 60 s; RF ablation; blood flow approximation; blood/electrode interface; body flux; film boundary condition; finite element models; heat lost to convection; in vitro; in vivo; lesion size; temperature profile; Blood flow; Boundary conditions; Electrodes; Equations; In vitro; In vivo; Lesions; Radio frequency; Size control; Temperature distribution;
Conference_Titel :
Engineering in Medicine and Biology Society, 1998. Proceedings of the 20th Annual International Conference of the IEEE
Conference_Location :
Hong Kong
Print_ISBN :
0-7803-5164-9
DOI :
10.1109/IEMBS.1998.745890