• DocumentCode
    333586
  • Title

    Characterization of improved tactile sensors using piezoelectric resonator

  • Author

    Maezawa, M. ; Kuroda, Y. ; Ohta, R.

  • Author_Institution
    Adv. Technol. Res. Center Dept., Olympus Opt. Co. Ltd., Tokyo, Japan
  • Volume
    4
  • fYear
    1998
  • fDate
    29 Oct-1 Nov 1998
  • Firstpage
    1731
  • Abstract
    An improved tactile sensor probe which detects the viscoelastic property of media has been developed. This sensor probe consists of a 1.5 mm×1.5 mm thickness mode piezoelectric resonator on a mounter sized 2.4 mm in diameter with energy trapped electrodes and two wires connected to the electrodes at the backside of the resonator. This size is small enough to be inserted into the human body for diagnostics. In addition the output signal of the sensor is stable even if the contact force or contact angle between the sensor and a medium changes because of its simple structure. The authors also experimentally confirmed the relationship between the sensor output and viscoelastic property expressed as a complex modulus (E*=E\´+JE"). The frequency shift of the sensor is closely related with the real part (E\´), and the amplitude change of the sensor mainly corresponds to the imaginary part (E"). It is possible to estimate the viscoelastic property of media with the frequency and the amplitude of the output signal of the new tactile sensor
  • Keywords
    biomedical transducers; biorheology; crystal resonators; probes; tactile sensors; viscoelasticity; 2.4 mm; Colpitts circuit; body cavity diagnostics; complex modulus; contact angle; contact force; energy trapped electrodes; frequency shift; human body; improved tactile sensors; medical instrumentation; output signal; sensor probe; Elasticity; Electrodes; Frequency estimation; Humans; Image sensors; Probes; Sensor phenomena and characterization; Tactile sensors; Viscosity; Wires;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society, 1998. Proceedings of the 20th Annual International Conference of the IEEE
  • Conference_Location
    Hong Kong
  • ISSN
    1094-687X
  • Print_ISBN
    0-7803-5164-9
  • Type

    conf

  • DOI
    10.1109/IEMBS.1998.746918
  • Filename
    746918