• DocumentCode
    333611
  • Title

    Fluid coupled metallic micromachined needle arrays

  • Author

    Brazzle, John ; Papautsky, Ian ; Frazier, A.B.

  • Author_Institution
    Utah Univ., Salt Lake City, UT, USA
  • Volume
    4
  • fYear
    1998
  • fDate
    29 Oct-1 Nov 1998
  • Firstpage
    1837
  • Abstract
    Fluid coupled metallic micromachined needle arrays are designed, fabricated, and characterized. The described hollow metallic needle arrays include design features such as dual structural supports and needle coupling channels. The supports and needle walls are formed by micro-electroformed metal to provide increased structural integrity. The needle coupling channels are used to fluidically interconnect the needles and allow pressure equalization and balance of fluid flow between needles. In addition, the needle coupling channels minimize the effects of restricted needle passages by providing a redistribution point for fluid flow between them. The optimum design for the needle coupling channels is investigated using an ANSYS finite element numerical model. The significance of this work includes the development of hollow, metallic micromachined needle arrays for biomedical applications. The authors also discuss structural, fluidic, and biological design considerations
  • Keywords
    arrays; biochemistry; biomedical equipment; chemical analysis; finite element analysis; micromachining; ANSYS finite element numerical model; biomedical applications; biomedical chemical analysis; dual structural supports; fluid coupled metallic micromachined needle arrays; fluid flow balance; increased structural integrity; micro-electroformed metal; needle coupling channels; pressure equalization; restricted needle passages effects; Epidermis; Finite element methods; Fluid flow; Manufacturing; Micromachining; Needles; Numerical models; Pharmaceutical technology; Silicon; Skin;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society, 1998. Proceedings of the 20th Annual International Conference of the IEEE
  • Conference_Location
    Hong Kong
  • ISSN
    1094-687X
  • Print_ISBN
    0-7803-5164-9
  • Type

    conf

  • DOI
    10.1109/IEMBS.1998.746949
  • Filename
    746949