DocumentCode
333612
Title
Progress towards a smart skin: fabrication and preliminary testing
Author
Liu, Robin H. ; Wang, Lin ; Beebe, David J.
Author_Institution
Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
Volume
4
fYear
1998
fDate
29 Oct-1 Nov 1998
Firstpage
1841
Abstract
This paper describes progress towards the development of a force sensitive skin (“smart skin”) capable of measuring force distributions on the human palmer and finger surface. Closely spaced normal force tactile sensing elements in a flexible skin have been successfully designed and fabricated based on silicon piezoresistive effect using MEMS (microelectromechanical systems) techniques. The sensing array consists of five elements each 4.4 mm in diameter, and arranged within a 16 mm circle designed to fit on a human finger tip. Preliminary bench testing shows the sensor performance is excellent with negligible hysteresis and good linearity (R=0.997). Normal loads of up to 180 N have been measured. A shear sensitive tactile sensor prototype was also developed. The preliminary results demonstrate that the prototype can sense both normal and shear forces with good linearity and repeatability
Keywords
biocontrol; biomechanics; diaphragms; force feedback; force sensors; intelligent sensors; microsensors; neuromuscular stimulation; patient rehabilitation; piezoresistive devices; prosthetics; tactile sensors; 16 mm; 4.4 mm; FNS; MEMS techniques; bench testing; closely spaced normal force tactile sensing elements; diaphragm; finger surface; flexible skin; force distributions measurement; force feedback; force sensitive skin; hand rehabilitation; linearity; micromachining; palmer surface; polyimide; repeatability; sensing array; sensory substitution devices; shear forces; shear sensitive tactile sensor prototype; silicon piezoresistive effect; smart skin; Fabrication; Fingers; Force measurement; Humans; Linearity; Prototypes; Silicon; Skin; Surface fitting; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Engineering in Medicine and Biology Society, 1998. Proceedings of the 20th Annual International Conference of the IEEE
Conference_Location
Hong Kong
ISSN
1094-687X
Print_ISBN
0-7803-5164-9
Type
conf
DOI
10.1109/IEMBS.1998.746950
Filename
746950
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