DocumentCode
3336131
Title
4500 V planar implanted anode p-i-n junction rectifiers in 4H-SiC
Author
Redison, J.B. ; Li, Z. ; Ramungul, N. ; Chow, T.P. ; Ghezzo, M. ; Kretchmer, J. ; Elasser, A.
Author_Institution
Center for Integrated Electron. & Electron. Manuf., Rensselaer Polytech. Inst., Troy, NY, USA
fYear
1999
fDate
23-23 June 1999
Firstpage
88
Lastpage
89
Abstract
SiC has been actively explored for high-temperature, high-voltage power electronics applications because of its wide bandgap, large avalanche electric field and high thermal conductivity. Recently, >5.5 kV epi-grown anode and 3kV aluminum-implanted anode 4H-SiC junction rectifiers have been reported. We also report a 1.1 kV junction rectifier that utilizes a deep boron implant for optimal junction leakage and a shallow Al/C co-implant for emitter injection and ohmic contact. An implanted anode process allows selective doping and hence fabricates planar rectifiers. This paper reports on the design, fabrication and electrical characterization of implanted anode 4H-SiC p-i-n rectifiers made using aluminum/carbon/boron co-implantation designed for 5 kV blocking capability and high-temperature operation.
Keywords
high-temperature electronics; ion implantation; leakage currents; ohmic contacts; p-i-n diodes; power semiconductor diodes; semiconductor materials; silicon compounds; solid-state rectifiers; 5 kV; SiC:Al,C,B; avalanche electric field; bandgap; blocking capability; electrical characterization; emitter injection; epi-grown anode; high-temperature operation; high-voltage power electronics; implanted anode; ohmic contact; optimal junction leakage; p-i-n junction rectifiers; planar implanted anode; selective doping; thermal conductivity; Anodes; Boron; Implants; Ohmic contacts; PIN photodiodes; Photonic band gap; Power electronics; Rectifiers; Silicon carbide; Thermal conductivity;
fLanguage
English
Publisher
ieee
Conference_Titel
Device Research Conference Digest, 1999 57th Annual
Conference_Location
Santa Barbara, CA, USA
Print_ISBN
0-7803-5170-3
Type
conf
DOI
10.1109/DRC.1999.806335
Filename
806335
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