• DocumentCode
    3336131
  • Title

    4500 V planar implanted anode p-i-n junction rectifiers in 4H-SiC

  • Author

    Redison, J.B. ; Li, Z. ; Ramungul, N. ; Chow, T.P. ; Ghezzo, M. ; Kretchmer, J. ; Elasser, A.

  • Author_Institution
    Center for Integrated Electron. & Electron. Manuf., Rensselaer Polytech. Inst., Troy, NY, USA
  • fYear
    1999
  • fDate
    23-23 June 1999
  • Firstpage
    88
  • Lastpage
    89
  • Abstract
    SiC has been actively explored for high-temperature, high-voltage power electronics applications because of its wide bandgap, large avalanche electric field and high thermal conductivity. Recently, >5.5 kV epi-grown anode and 3kV aluminum-implanted anode 4H-SiC junction rectifiers have been reported. We also report a 1.1 kV junction rectifier that utilizes a deep boron implant for optimal junction leakage and a shallow Al/C co-implant for emitter injection and ohmic contact. An implanted anode process allows selective doping and hence fabricates planar rectifiers. This paper reports on the design, fabrication and electrical characterization of implanted anode 4H-SiC p-i-n rectifiers made using aluminum/carbon/boron co-implantation designed for 5 kV blocking capability and high-temperature operation.
  • Keywords
    high-temperature electronics; ion implantation; leakage currents; ohmic contacts; p-i-n diodes; power semiconductor diodes; semiconductor materials; silicon compounds; solid-state rectifiers; 5 kV; SiC:Al,C,B; avalanche electric field; bandgap; blocking capability; electrical characterization; emitter injection; epi-grown anode; high-temperature operation; high-voltage power electronics; implanted anode; ohmic contact; optimal junction leakage; p-i-n junction rectifiers; planar implanted anode; selective doping; thermal conductivity; Anodes; Boron; Implants; Ohmic contacts; PIN photodiodes; Photonic band gap; Power electronics; Rectifiers; Silicon carbide; Thermal conductivity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Device Research Conference Digest, 1999 57th Annual
  • Conference_Location
    Santa Barbara, CA, USA
  • Print_ISBN
    0-7803-5170-3
  • Type

    conf

  • DOI
    10.1109/DRC.1999.806335
  • Filename
    806335