DocumentCode :
3336131
Title :
4500 V planar implanted anode p-i-n junction rectifiers in 4H-SiC
Author :
Redison, J.B. ; Li, Z. ; Ramungul, N. ; Chow, T.P. ; Ghezzo, M. ; Kretchmer, J. ; Elasser, A.
Author_Institution :
Center for Integrated Electron. & Electron. Manuf., Rensselaer Polytech. Inst., Troy, NY, USA
fYear :
1999
fDate :
23-23 June 1999
Firstpage :
88
Lastpage :
89
Abstract :
SiC has been actively explored for high-temperature, high-voltage power electronics applications because of its wide bandgap, large avalanche electric field and high thermal conductivity. Recently, >5.5 kV epi-grown anode and 3kV aluminum-implanted anode 4H-SiC junction rectifiers have been reported. We also report a 1.1 kV junction rectifier that utilizes a deep boron implant for optimal junction leakage and a shallow Al/C co-implant for emitter injection and ohmic contact. An implanted anode process allows selective doping and hence fabricates planar rectifiers. This paper reports on the design, fabrication and electrical characterization of implanted anode 4H-SiC p-i-n rectifiers made using aluminum/carbon/boron co-implantation designed for 5 kV blocking capability and high-temperature operation.
Keywords :
high-temperature electronics; ion implantation; leakage currents; ohmic contacts; p-i-n diodes; power semiconductor diodes; semiconductor materials; silicon compounds; solid-state rectifiers; 5 kV; SiC:Al,C,B; avalanche electric field; bandgap; blocking capability; electrical characterization; emitter injection; epi-grown anode; high-temperature operation; high-voltage power electronics; implanted anode; ohmic contact; optimal junction leakage; p-i-n junction rectifiers; planar implanted anode; selective doping; thermal conductivity; Anodes; Boron; Implants; Ohmic contacts; PIN photodiodes; Photonic band gap; Power electronics; Rectifiers; Silicon carbide; Thermal conductivity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Device Research Conference Digest, 1999 57th Annual
Conference_Location :
Santa Barbara, CA, USA
Print_ISBN :
0-7803-5170-3
Type :
conf
DOI :
10.1109/DRC.1999.806335
Filename :
806335
Link To Document :
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