DocumentCode :
3336412
Title :
Development of Rapid Mask Fabrication Technology for Micro-Abrasive Machining
Author :
Lee, In Hwan ; Seung Pyo Lee ; Ko, Tae Jo ; Kang, Hyun Wook ; Cho, Dong-Woo
Author_Institution :
Sch. of Mech. Eng., Chungbuk Nat. Univ., Cheongju
fYear :
2008
fDate :
9-11 April 2008
Firstpage :
363
Lastpage :
366
Abstract :
Micro-abrasive jet machining (mu-AJM) has become a useful technique for micro-machining of a brittle material such as glass, silicon, etc. This technology is mainly based on the erosion of a mask which protects substrate against high velocity of micro-particles. Generally, for the fabrication of a mask in the mu-AJM process, a photomask based on the semi-conductor fabrication process was used. In this research, a rapid mask fabrication technology based on micro-stereolithography technology has been developed for the mu-AJM. By scanning the focused UV laser beam, a micro-mask pattern was fabricated directly without photolithography process and photomask. Si wafer were abrasive-jet machined using fabricated mask patterns.
Keywords :
brittleness; erosion; laser beam applications; masks; micromachining; semiconductor technology; silicon; stereolithography; substrates; Si wafer; UV laser beam; brittle material; microabrasive jet machining; micromask pattern; microstereolithography technology; photolithography process; photomask; rapid mask fabrication technology; semiconductor fabrication process; substrate protects; Commercialization; Fiber lasers; Laser beams; Lithography; Machining; Mechanical engineering; Optical device fabrication; Optical fibers; Protection; Substrates; mask; micro-abrasive jet machining; micro-stereolithography;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Smart Manufacturing Application, 2008. ICSMA 2008. International Conference on
Conference_Location :
Gyeonggi-do
Print_ISBN :
978-89-950038-8-6
Electronic_ISBN :
978-89-962150-0-4
Type :
conf
DOI :
10.1109/ICSMA.2008.4505553
Filename :
4505553
Link To Document :
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