• DocumentCode
    3337268
  • Title

    Electromagnetic simulation of microstrip patch antennas

  • Author

    Zheng, J.-X.

  • Author_Institution
    Zeland Software Inc., San Fransico, CA, USA
  • Volume
    1
  • fYear
    1994
  • fDate
    20-24 June 1994
  • Firstpage
    318
  • Abstract
    Discusses the use of a general purpose CAD tool, the IE3D Electromagnetic Simulation and Optimization Package, in analysis and design of microstrip patch antennas. The simulator is based upon a full-wave integral equation formulation. It has the capability of simulating planar and 3D printed structures of arbitrary shape in microwave and millimeter-wave integrated circuits (MMIC), microstrip antennas and other high frequency and high speed applications. The authors describe the simulator´s application in modeling a multi-layered coupled antenna, a probe-fed circular patch antenna and an edge-fed rectangular antenna The simulator is not limited to the demonstrated examples. It can be used to model microstrip antennas of other shapes. Simulation results on the IE3D are compared to the measured results and other simulation results on literature.<>
  • Keywords
    CAD; antenna theory; digital simulation; electrical engineering computing; integral equations; microstrip antennas; simulation; 3D printed structures; IE3D Electromagnetic Simulation and Optimization Package; MMIC; edge-fed rectangular antenna; electromagnetic simulation; full-wave integral equation; general purpose CAD tool; microstrip patch antennas; microwave integrated circuits; millimeter-wave integrated circuits; multi-layered coupled antenna; planar structures; probe-fed circular patch antenna; Analytical models; Circuit simulation; Design automation; Design optimization; Electromagnetic analysis; Integral equations; Integrated circuit packaging; Microstrip antennas; Patch antennas; Shape;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Antennas and Propagation Society International Symposium, 1994. AP-S. Digest
  • Conference_Location
    Seattle, WA, USA
  • Print_ISBN
    0-7803-2009-3
  • Type

    conf

  • DOI
    10.1109/APS.1994.407748
  • Filename
    407748