• DocumentCode
    3337507
  • Title

    Figure-of-merit and emissivity measurement of fine-grained polycrystalline silicon thin films

  • Author

    Jacguot, A. ; Liu, W.L. ; Chen, G. ; Fleurial, J.P. ; Dauscher, A. ; Lenoir, B.

  • Author_Institution
    CNRS, Ecole des Mines, Nancy, France
  • fYear
    2002
  • fDate
    25-29 Aug. 2002
  • Firstpage
    118
  • Lastpage
    121
  • Abstract
    The thermoelectric properties of phosphorus and boron doped fine-grained polycrystalline silicon thin films have been measured along with the emissivity at room temperature. The thermal conductivity of the films is reduced by one order of magnitude, compared to the undoped single crystalline material, whatever the doping level and the doping atoms are. The electrical conductivity is reduced by the fine-grained structure of the layer, but to a lesser extent than the thermal conductivity. The thermopower remains almost unchanged. As a consequence, the figure-of-merit of these thin films is larger than that of the bulk materials doped at similar carrier concentrations. These measurements suggest that grain size reduction can be effective in enhancing ZT. A link is made between the deposition parameters, the microstructure, and the transport properties.
  • Keywords
    boron; carrier density; electrical conductivity; elemental semiconductors; emissivity; grain size; phosphorus; semiconductor thin films; silicon; thermal conductivity; thermoelectric power; Si:B; Si:P; ZT; carrier concentration; electrical conductivity; emissivity; figure-of-merit; fine-grained polycrystalline silicon thin films; grain size; thermal conductivity; thermoelectric properties; thermopower; Atomic layer deposition; Boron; Conductive films; Crystalline materials; Doping; Semiconductor thin films; Silicon; Temperature; Thermal conductivity; Thermoelectricity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermoelectrics, 2002. Proceedings ICT '02. Twenty-First International Conference on
  • Print_ISBN
    0-7803-7683-8
  • Type

    conf

  • DOI
    10.1109/ICT.2002.1190279
  • Filename
    1190279