• DocumentCode
    3337530
  • Title

    The study for the mechanism on the noble thermoelectric properties of the amorphous Si-Ge-Au thin films

  • Author

    Lee, Sang Min ; Okamoto, Yoichi ; Kawahara, Toshio ; Morimoto, Jun

  • Author_Institution
    Dept. of Mater. Sci. & Eng., Nat. Defense Acad., Kanagawa, Japan
  • fYear
    2002
  • fDate
    25-29 Aug. 2002
  • Firstpage
    126
  • Lastpage
    129
  • Abstract
    In order to disclose the important parameter from factors which affected to thermoelectric properties of the amorphous Si-Ge-Au thin films, annealing of samples were repeated with temperature range between room temperature and 1000 K. Electrical resistivity was stabilized in whole temperature range by only one thermal annealing cycle. On the other hand, thermoelectric power was not stabilized in whole temperature range even after several annealing cycles. Electrical resistivity and thermoelectric power of the amorphous Si-Ge-Au thin films could be affected by different parameters of amorphous structure such as dangling bonds, bond angle and interatomic distance. Further, improvement of the thermoelectric properties can be achieved with controlling the annealing temperature range and number of annealing cycle which affects to amorphous parameters.
  • Keywords
    Ge-Si alloys; annealing; bond angles; bond lengths; dangling bonds; electrical resistivity; glass structure; gold alloys; metallic glasses; metallic thin films; thermoelectric power; 300 to 1000 K; Si-Ge-Au; amorphous Si-Ge-Au thin films; amorphous structure; annealing; bond angle; dangling bonds; electrical resistivity; interatomic distance; thermoelectric power; thermoelectric properties; Amorphous materials; Annealing; Electric resistance; Mechanical factors; Temperature control; Temperature distribution; Thermal factors; Thermal resistance; Thermoelectricity; Transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermoelectrics, 2002. Proceedings ICT '02. Twenty-First International Conference on
  • Print_ISBN
    0-7803-7683-8
  • Type

    conf

  • DOI
    10.1109/ICT.2002.1190281
  • Filename
    1190281