DocumentCode :
3337674
Title :
[Front cover]
fYear :
2010
fDate :
23-26 Sept. 2010
Abstract :
The following topics are dealt with: assembly and manufacturing technology; electronic circuits; electronics systems and power electronics; microsystems packaging; optoelectronics and advanced communication packaging; applied reliability and thermal management; emerging technologies and trends in advanced packaging; and challenge in global education.
Keywords :
assembling; electronics packaging; integrated optoelectronics; manufacturing systems; micromechanical devices; power electronics; advanced communication packaging; advanced packaging; applied reliability; assembly technology; electronic circuit; electronic packaging; electronics system; emerging technology; global education; manufacturing technology; microsystems packaging; optoelectronics; power electronics; thermal management;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design and Technology in Electronic Packaging (SIITME), 2010 IEEE 16th International Symposium for
Conference_Location :
Pitesti
Print_ISBN :
978-1-4244-8123-1
Type :
conf
DOI :
10.1109/SIITME.2010.5651710
Filename :
5651710
Link To Document :
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