Abstract :
The following topics are dealt with: assembly and manufacturing technology; electronic circuits; electronics systems and power electronics; microsystems packaging; optoelectronics and advanced communication packaging; applied reliability and thermal management; emerging technologies and trends in advanced packaging; and challenge in global education.
Keywords :
assembling; electronics packaging; integrated optoelectronics; manufacturing systems; micromechanical devices; power electronics; advanced communication packaging; advanced packaging; applied reliability; assembly technology; electronic circuit; electronic packaging; electronics system; emerging technology; global education; manufacturing technology; microsystems packaging; optoelectronics; power electronics; thermal management;
Conference_Titel :
Design and Technology in Electronic Packaging (SIITME), 2010 IEEE 16th International Symposium for
Conference_Location :
Pitesti
Print_ISBN :
978-1-4244-8123-1
DOI :
10.1109/SIITME.2010.5651710
