• DocumentCode
    3337768
  • Title

    Study on estimating the planting area of winter wheat based on mixed field decomposition of remote sensing

  • Author

    Gu, Xiaohe ; Zhang, Jingcheng ; Pan, Yaozhong ; Tangao Hu ; Le Li ; Chao Li

  • Author_Institution
    Nat. Eng. Res. Center for Inf. Technol. in Agric., Beijing, China
  • fYear
    2010
  • fDate
    25-30 July 2010
  • Firstpage
    2131
  • Lastpage
    2134
  • Abstract
    With the significantly improved data availability in remote sensing technology, mid-resolution images have become the primary data source for crop sown area measurement in large scale. However, it is still difficult to solve the problems of spectrum heterogeneity in one field and spectra similarity between fields. This paper developed mixed field decomposition method and tested the method in an urban agriculture region with complex plant structure through several steps: first, distinguishing the mixed parcels by calculating the coefficient of variation of multi-temporal TM image within the parcels; then, operating multivariate regression model and mixed field decomposition model based on support vector machine (SVM) to estimate the sown area of winter wheat in the mixed parcels with different sample size. Results show that the mixed field decomposition of SVM has a higher accuracy than the multivariate regression model both in amount and position.
  • Keywords
    crops; geophysical techniques; support vector machines; vegetation mapping; crop sown area measurement; mixed field decomposition; multitemporal TM image; multivariate regression model; planting area; remote sensing; support vector machine; urban agriculture region; winter wheat; Accuracy; Agriculture; Multivariate regression; Pixel; Remote sensing; Support vector machines; Vegetation mapping; Multivariate; Plant area; Regress; Support Vector Machine; Winter wheat; decomposition; mixed field;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Geoscience and Remote Sensing Symposium (IGARSS), 2010 IEEE International
  • Conference_Location
    Honolulu, HI
  • ISSN
    2153-6996
  • Print_ISBN
    978-1-4244-9565-8
  • Electronic_ISBN
    2153-6996
  • Type

    conf

  • DOI
    10.1109/IGARSS.2010.5651717
  • Filename
    5651717