• DocumentCode
    3337810
  • Title

    Digital architecture of the new ATLAS pixel chip FE-I4

  • Author

    Hemperek, Tomasz ; Arutinov, David ; Barbero, Marlon ; Beccherle, Roberto ; Darbo, Giovanni ; Dube, Sourabh ; Elledge, David ; Fougeron, Denis ; Garcia-Sciveres, Maurice ; Gnani, Dario ; Gromov, Vladimir ; Karagounis, Michael ; Kluit, Ruud ; Kruth, Andre

  • Author_Institution
    Phys. Dept., Univ. of Bonn, Bonn, Germany
  • fYear
    2009
  • fDate
    Oct. 24 2009-Nov. 1 2009
  • Firstpage
    791
  • Lastpage
    796
  • Abstract
    With the high hit rate foreseen for the innermost layers at an upgraded LHC, the current ATLAS Front-End pixel chip FE-I3 would start being inefficient. The main source of inefficiency comes from the copying mechanism of the pixel hits from the pixel array to the end of column buffers. A new ATLAS pixel chip FE-I4 is being developed in a 130 nm technology for use both in the framework of the Insertable B-Layer (IBL) project and for the outer layers of Super-LHC. FE-I4 is made of 80×336 pixels and features a reduced pixel size of 50×250 ¿m2. In the current design, a new digital architecture is introduced in which hit memories are distributed across the entire pixel array and the pixels organized in regions. In this paper, the digital architecture of FE-I4 is presented as well as the complete data flow.
  • Keywords
    nanotechnology; nuclear electronics; 130 nm technology; ATLAS Front-End pixel chip FE-I3; ATLAS pixel chip; FE-I4; Insertable B-Layer project; LHC innermost layers; Super-LHC; copying mechanism; digital architecture; high hit rate; hit memories; pixel hits; Circuits; Clocks; Delay; Digital recording; Fires; Frequency; Large Hadron Collider; Memory; Nuclear and plasma sciences; Physics;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nuclear Science Symposium Conference Record (NSS/MIC), 2009 IEEE
  • Conference_Location
    Orlando, FL
  • ISSN
    1095-7863
  • Print_ISBN
    978-1-4244-3961-4
  • Electronic_ISBN
    1095-7863
  • Type

    conf

  • DOI
    10.1109/NSSMIC.2009.5402304
  • Filename
    5402304