DocumentCode
3337846
Title
Foreword
fYear
2010
fDate
23-26 Sept. 2010
Abstract
Presents the introductory welcome message from the conference proceedings.
fLanguage
English
Publisher
ieee
Conference_Titel
Design and Technology in Electronic Packaging (SIITME), 2010 IEEE 16th International Symposium for
Conference_Location
Pitesti
Print_ISBN
978-1-4244-8123-1
Type
conf
DOI
10.1109/SIITME.2010.5651722
Filename
5651722
Link To Document