• DocumentCode
    3337890
  • Title

    Transient analysis of nonlinearly loaded arrangements consisting of thin wires and metallic patches

  • Author

    Deiseroth, K. ; Singer, H.

  • Author_Institution
    Tech. Univ. Hamburg-Harburg, Germany
  • fYear
    195
  • fDate
    14-18 Aug 195
  • Firstpage
    636
  • Lastpage
    641
  • Abstract
    A combined frequency and time domain procedure for the simulation of arbitrary nonlinearly loaded arrangements consisting of metallic patches and thin wires is presented. The time-invariant, linear part of the structure is analysed by means of the method of moments in the frequency domain while the characteristics of the nonlinear, time-variant elements are included via a convolution integral of Volterra-type in the time domain. The universal applicability of the algorithm to a large variety of EMC problems is demonstrated by means of a simulation example and the results are verified by measurements. Finally a procedure for the characterisation of one-port nonlinear devices up to high frequencies based on a nonlinear node analysis and interpolation is presented
  • Keywords
    Volterra equations; convolution; electromagnetic compatibility; interpolation; method of moments; nonlinear network analysis; time-frequency analysis; time-varying networks; transient analysis; EMC problems; Volterra-type convolution integral; combined frequency and time domain procedure; frequency domain procedure; interpolation; metallic patches; method of moments; nonlinear node analysis; nonlinearly loaded arrangements; one-port nonlinear devices; thin wires; time domain procedure; transient analysis; Circuit testing; Diodes; Electromagnetic compatibility; Finite difference methods; Frequency domain analysis; Power system transients; Protection; Time domain analysis; Transient analysis; Wires;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility, 1995. Symposium Record., 1995 IEEE International Symposium on
  • Conference_Location
    Atlanta, GA
  • Print_ISBN
    0-7803-3608-9
  • Type

    conf

  • DOI
    10.1109/ISEMC.1995.523635
  • Filename
    523635