• DocumentCode
    3338549
  • Title

    A simple and sensitive apparatus for Seebeck coefficient measurement down to 77 K

  • Author

    Sivakumar, K.M. ; Singh, R.K. ; Gaur, N.K. ; Ganesan, V.

  • Author_Institution
    RKDF Inst. of Sci. & Technol., Bhopal, India
  • fYear
    2002
  • fDate
    25-29 Aug. 2002
  • Firstpage
    337
  • Lastpage
    340
  • Abstract
    A simple and sensitive experimental set-up for low temperature Seebeck coefficient measurement has been fabricated using copper block sandwich type technique (dc) down to 77 K. The flexibility of the system has been demonstrated by carrying out measurements on different type of samples (Platinum, YBCO, and Metallic glass) with different geometry (wire, pellet and foil). In order to attain better stability and sensitivity, some new techniques are proposed by applying the concept isothermal zone. The effective sample holder design helps for much easier way of sample mounting and the present techniques employed for thermocouple mounting and signal leads contact increase electrical and thermal stabilities of the system with better sensitivity and lesser thermal time constant. The system is sensitive to a change of 25 mK in gradient (YBCO with S=5 micro Volt/Kelvin). We could attain a stability of ±15 nV, ±3 mK and ±1 mK in signal, gradient and temperature respectively.
  • Keywords
    Seebeck effect; electric variables measurement; low-temperature techniques; sample holders; thermocouples; 77 K; Cu; Cu block sandwich type technique; Pt; Seebeck coefficient measurement; YBaCuO; effective sample holder design; isothermal zone; metallic glass; sample geometry; sensitive apparatus; signal leads contact; stability; thermocouple mounting; Geometry; Glass; Isothermal processes; Platinum; Signal design; Stability; Temperature measurement; Temperature sensors; Wire; Yttrium barium copper oxide;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermoelectrics, 2002. Proceedings ICT '02. Twenty-First International Conference on
  • Print_ISBN
    0-7803-7683-8
  • Type

    conf

  • DOI
    10.1109/ICT.2002.1190334
  • Filename
    1190334