Title :
Collection of papers presented at the 14th International Workshop on THERMal INvestigation of ICs and Systems
Abstract :
The following topics were dealt with: electronics cooling; CFD; MCAD; EDA; reliability; nanopack; sensors; LED.
Keywords :
CAD; computational fluid dynamics; cooling; integrated circuit packaging; integrated circuit reliability; nanotechnology; standardisation; CFD; EDA; LED; MCAD; electronics cooling; nanopack; reliability; sensors;
Conference_Titel :
Thermal Inveatigation of ICs and Systems, 2008. THERMINIC 2008. 14th International Workshop on
Conference_Location :
Rome
Print_ISBN :
978-1-4244-3365-0
DOI :
10.1109/THERMINIC.2008.4669862
