• DocumentCode
    3339001
  • Title

    CFD for Electronics Cooling: MCAD and EDA embedded vs. stand-alone

  • Author

    Parry, John D.

  • Author_Institution
    Mech. Anal. Div., Mentor Graphics Corp., East Molesey
  • fYear
    2008
  • fDate
    24-26 Sept. 2008
  • Firstpage
    1
  • Lastpage
    7
  • Abstract
    Computational fluid dynamics (CFD) for electronics cooling (EC) has developed differently from general-purpose CFD, due to the nature of the market it serves. The benefits are clear - the use of EC CFD in product design has had a profound impact on both time-to-market and cost.
  • Keywords
    CAD; computational fluid dynamics; cooling; integrated circuit packaging; CFD; EDA vendors; IC package; MCAD; application-specific codes; computational fluid dynamics; electronics cooling; equipment design; product creation process; stand-alone software; thermal design; Application software; Computational fluid dynamics; Consumer electronics; Electronic design automation and methodology; Electronic packaging thermal management; Electronics cooling; Fluid dynamics; Graphics; Packaging machines; Product design;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal Inveatigation of ICs and Systems, 2008. THERMINIC 2008. 14th International Workshop on
  • Conference_Location
    Rome
  • Print_ISBN
    978-1-4244-3365-0
  • Electronic_ISBN
    978-2-35500-008-9
  • Type

    conf

  • DOI
    10.1109/THERMINIC.2008.4669869
  • Filename
    4669869
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3339001