Title :
Evaluation of short pulse thermal transient measurements
Author_Institution :
Dept. of Electron Devices, Budapest Univ. of Technol. & Econ., Budapest
Abstract :
Thermal transient recording and the time constant spectrum analysis are widely used methods in the testing and qualification of IC packages. A limitation of these methods is that recording of the complete transient response requires long time. The paper offers algorithms to evaluate short pulse and short time measurements. These methods are suitable if only the extraction of the short time constants are needed. This is the case if the transient method is used for die attach quality checking.
Keywords :
integrated circuit packaging; integrated circuit testing; spectral analysis; transient response; IC package testing; die attach quality checking; short pulse thermal transient measurements; thermal transient recording; time constant spectrum analysis; transient response; Cooling; Integrated circuit packaging; Integrated circuit testing; Power measurement; Pulse measurements; Qualifications; Steady-state; Thermal resistance; Time measurement; Transient analysis;
Conference_Titel :
Thermal Inveatigation of ICs and Systems, 2008. THERMINIC 2008. 14th International Workshop on
Conference_Location :
Rome
Print_ISBN :
978-1-4244-3365-0
Electronic_ISBN :
978-2-35500-008-9
DOI :
10.1109/THERMINIC.2008.4669872
