• DocumentCode
    3339171
  • Title

    Assessment of die attach quality by analysis of circuit thermal response spectrum

  • Author

    Janicki, M. ; Vermeersch, B. ; Banaszczyk, J. ; Kaminski, M. ; De Mey, G. ; Napieralsk, A.

  • Author_Institution
    Radon Inst. for Comput. & Appl. Math., Austrian Acad. of Sci., Linz
  • fYear
    2008
  • fDate
    24-26 Sept. 2008
  • Firstpage
    43
  • Lastpage
    46
  • Abstract
    This paper investigates the possibility of assessing the die attach quality by the spectral analysis of the recorded device time response. The conducted analyses of the measured and the simulated time constant spectra of the thermal response allowed the explanation of the anomalous electrical oscillations observed during the operation of a power converter.
  • Keywords
    circuit oscillations; microassembling; power convertors; spectral analysis; circuit thermal response spectrum; die attach quality; electrical oscillations; power converter; recorded device time response; spectral analysis; Analytical models; Circuit analysis; Circuit simulation; Electric variables measurement; Microassembly; Power measurement; Spectral analysis; Thermal conductivity; Time factors; Time measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal Inveatigation of ICs and Systems, 2008. THERMINIC 2008. 14th International Workshop on
  • Conference_Location
    Rome
  • Print_ISBN
    978-1-4244-3365-0
  • Electronic_ISBN
    978-2-35500-008-9
  • Type

    conf

  • DOI
    10.1109/THERMINIC.2008.4669876
  • Filename
    4669876
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3339171