DocumentCode :
3339243
Title :
Solder paste printing in six-sigma-quality
Author :
Wohlrabe, Heinz
Author_Institution :
Centre of Microtechnical Manuf., Tech. Univ. Dresden, Dresden, Germany
fYear :
2010
fDate :
23-26 Sept. 2010
Firstpage :
33
Lastpage :
38
Abstract :
The solder paste printing is one important part of the manufacturing process. More than 50% of all defects of SMT-boards are caused by the printing process. Six-sigma-quality is one common important goal of manufacturing processes. Another criterions or such a quality are a defect rate of about 3,4 DPM (defects per million) or a process capability Cpk > 1,5. The printed solder paste volume, the printed area; the height and the deviations (x/y) are the most important quality characteristics, to evaluate the printing quality. The paper shows some practical experiments and the associated results, to optimize the printing process.
Keywords :
printing; solders; surface mount technology; SMT-boards; manufacturing process; six-sigma-quality; solder paste printing; Apertures; Cleaning; Electronics packaging; Equations; Mathematical model; Printing; Six sigma;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design and Technology in Electronic Packaging (SIITME), 2010 IEEE 16th International Symposium for
Conference_Location :
Pitesti
Print_ISBN :
978-1-4244-8123-1
Type :
conf
DOI :
10.1109/SIITME.2010.5651807
Filename :
5651807
Link To Document :
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