• DocumentCode
    3339471
  • Title

    Design of a static TIM tester

  • Author

    Székely, V. ; Somlay, G. ; Szabò, P.G. ; Rencz, M.

  • Author_Institution
    Dept. of Electron Devices, Budapest Univ. of Technol. & Econ., Budapest
  • fYear
    2008
  • fDate
    24-26 Sept. 2008
  • Firstpage
    132
  • Lastpage
    136
  • Abstract
    Nowadays the quality of thermal interface materials (TIM) has a growing importance as the increasing dissipation level of ICs requires more and more sophisticated solutions to reduce the Rth along the heat-flow path. The recent approach of TIM manufacturers is to use nanoparticles as fillings in TIM materials, in order to enhance considerably the TIM thermal conductivity. On the other hand this solution raises difficulties in the characterization of these materials. Namely, the resolution of the conventional methods is not high enough to measure resistance values as low as 0.01-0.05 Kcm2/W. This is the reason why we developed static TIM tester equipment using some new concepts. The main idea behind our design is to use the capabilities of microelectronics in order to make small sized sensors both for temperature and heat flux sensing. This way it is possible to place these sensors in the closest proximity of the measured sample. The status of this work is presented in the paper.
  • Keywords
    cooling; integrated circuit testing; temperature sensors; thermal conductivity; thermal resistance measurement; dissipation level; heat flux sensors; static TIM tester; temperature sensors; thermal conductivity; thermal interface materials; thermal resistance measurement; Conducting materials; Electrical resistance measurement; Filling; Manufacturing; Microelectronics; Nanoparticles; Temperature sensors; Testing; Thermal conductivity; Thermal sensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal Inveatigation of ICs and Systems, 2008. THERMINIC 2008. 14th International Workshop on
  • Conference_Location
    Rome
  • Print_ISBN
    978-1-4244-3365-0
  • Electronic_ISBN
    978-2-35500-008-9
  • Type

    conf

  • DOI
    10.1109/THERMINIC.2008.4669894
  • Filename
    4669894