DocumentCode
3339471
Title
Design of a static TIM tester
Author
Székely, V. ; Somlay, G. ; Szabò, P.G. ; Rencz, M.
Author_Institution
Dept. of Electron Devices, Budapest Univ. of Technol. & Econ., Budapest
fYear
2008
fDate
24-26 Sept. 2008
Firstpage
132
Lastpage
136
Abstract
Nowadays the quality of thermal interface materials (TIM) has a growing importance as the increasing dissipation level of ICs requires more and more sophisticated solutions to reduce the Rth along the heat-flow path. The recent approach of TIM manufacturers is to use nanoparticles as fillings in TIM materials, in order to enhance considerably the TIM thermal conductivity. On the other hand this solution raises difficulties in the characterization of these materials. Namely, the resolution of the conventional methods is not high enough to measure resistance values as low as 0.01-0.05 Kcm2/W. This is the reason why we developed static TIM tester equipment using some new concepts. The main idea behind our design is to use the capabilities of microelectronics in order to make small sized sensors both for temperature and heat flux sensing. This way it is possible to place these sensors in the closest proximity of the measured sample. The status of this work is presented in the paper.
Keywords
cooling; integrated circuit testing; temperature sensors; thermal conductivity; thermal resistance measurement; dissipation level; heat flux sensors; static TIM tester; temperature sensors; thermal conductivity; thermal interface materials; thermal resistance measurement; Conducting materials; Electrical resistance measurement; Filling; Manufacturing; Microelectronics; Nanoparticles; Temperature sensors; Testing; Thermal conductivity; Thermal sensors;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal Inveatigation of ICs and Systems, 2008. THERMINIC 2008. 14th International Workshop on
Conference_Location
Rome
Print_ISBN
978-1-4244-3365-0
Electronic_ISBN
978-2-35500-008-9
Type
conf
DOI
10.1109/THERMINIC.2008.4669894
Filename
4669894
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