Title :
VLSI interconnect modeling at multi-GHz frequencies incorporating inductance
Author :
Zadpour, M. A A ; Kalkur, T.S.
Author_Institution :
Dept. of Electr. & Comput. Eng., Colorado Univ., Colorado Springs, CO, USA
Abstract :
Due to decreasing device sizes and increasing clock speed, the interconnect delay is the dominant factor in clock skew. This delay has been extracted as the RC component in available EDA tools. In this paper, we model the interconnect as RLC components for systems running at multi-GHz clock speeds. A static extraction analysis method, optimized for VLSI, is detailed which considers all the lines within the vicinity of the target line as return paths. Novel formulas are presented for parallel and series RLC circuit reduction. Results characterization and future research areas are also discussed.
Keywords :
RLC circuits; VLSI; circuit CAD; inductance; integrated circuit design; integrated circuit interconnections; integrated circuit modelling; logic CAD; CAD tools; EDA tools; RLC components; VLSI interconnect modeling; VLSI optimized extraction method; clock nets; clock skew; clock speed; delay RC component; device sizes; inductance; interconnect delay extraction; parallel RLC circuit reduction; return path lines; series RLC circuit reduction; static extraction analysis; target line; Clocks; Data mining; Delay; Frequency; Impedance; Inductance; Integrated circuit interconnections; Springs; Very large scale integration; Wire;
Conference_Titel :
Mixed-Signal Design, 2003. Southwest Symposium on
Print_ISBN :
0-7803-7778-8
DOI :
10.1109/SSMSD.2003.1190396