• DocumentCode
    3339629
  • Title

    Micro-channel heat sink optimization

  • Author

    Catton, Ivan

  • Author_Institution
    Dept. of Mech. & Aerosp. Eng., Univ. of California, Los Angeles, CA
  • fYear
    2008
  • fDate
    24-26 Sept. 2008
  • Firstpage
    177
  • Lastpage
    182
  • Abstract
    An increasing demand for a higher heat flux removal capability within a smaller volume for high power electronics led us to focus on micro channels in contrast to the classical heat fin design. A micro channel can have various shapes to enhance heat transfer, but the shape that will lead to a higher heat flux removal with a moderate pumping power needs to be determined. The micro channel geometries explored are pin fins (staggered) and parallel plates. The problem solved here is a conjugate problem involving two heat transfer mechanisms; (1) porous media effective conductivity and (2) internal convective heat transfer coefficient. Volume averaging theory (VAT) is used to rigorously cast the point wise conservation of energy, momentum and mass equations into a form that represents the thermal and hydraulic properties of the micro channel (porous media) morphology. Using the resulting VAT based field equations, optimization of a micro channel heated from one side is used to determine the optimum micro channel morphology. A standard commercial size and design is chosen for analysis and to demonstrate the utility of the VAT based process.
  • Keywords
    heat sinks; heat transfer; microchannel flow; optimisation; thermal management (packaging); heat flux removal capability; high power electronics; hydraulic property; internal convective heat transfer coefficient; microchannel heat sink optimization; microchannel morphology; parallel plates; pin fins; porous media effective conductivity; thermal property; volume averaging theory; Design optimization; Equations; Heat engines; Heat sinks; Heat transfer; Heat treatment; Morphology; Nonhomogeneous media; Numerical simulation; Resistance heating;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal Inveatigation of ICs and Systems, 2008. THERMINIC 2008. 14th International Workshop on
  • Conference_Location
    Rome
  • Print_ISBN
    978-1-4244-3365-0
  • Electronic_ISBN
    978-2-35500-008-9
  • Type

    conf

  • DOI
    10.1109/THERMINIC.2008.4669904
  • Filename
    4669904