Title :
2008 IEEE international conference on microelectronic test structures
Abstract :
The following topics are dealt: microelectronic test structures; matching characterisation; resistivity determination; microelectronics yield and reliability; 3D integration technology; MOS modeling and characterisation; RF; and integrated circuit interconnect.
Keywords :
MOSFET; analogue integrated circuits; digital integrated circuits; electrical resistivity; integrated circuit interconnections; integrated circuit measurement; integrated circuit reliability; integrated circuit testing; integrated circuit yield; radiofrequency integrated circuits; semiconductor device models; 3D integration technology; MOS characterisation; MOS modeling; RF; integrated circuit interconnect; matching characterisation; microelectronic test structures; microelectronic yield; microelectronics reliability; resistivity determination;
Conference_Titel :
Microelectronic Test Structures, 2008. ICMTS 2008. IEEE International Conference on
Conference_Location :
Edinburgh
Print_ISBN :
978-1-4244-1800-8
Electronic_ISBN :
978-1-4244-1801-5
DOI :
10.1109/ICMTS.2008.4509304
