Title :
Preparation and dielectric behavior of epoxy resin containing graphene oxide
Author :
Mancinelli, P. ; Fabiani, Davide ; Saccani, A. ; Toselli, M. ; Heid, T. ; Frechette, Michel ; Savoie, S. ; David, E.
Author_Institution :
DEI, Univ. of Bologna, Bologna, Italy
fDate :
June 30 2013-July 4 2013
Abstract :
Graphene oxide (GO) and chemically modified graphene oxide have been dispersed in low amount (until 0.5 wt%) into epoxy resin. Comparing the dielectric responses of the polymer nanocomposites with those of neat epoxy, no significantly changes were noted. Relevant differences were recorded after a post-curing heating treatment able to reduce the dispersed GO to more conductive graphene. Neat epoxy and epoxy samples with chemically modified GO had usually a small decrease on permittivity while GO samples showed an increase of about 10% of the value previously observed. This behavior will be connected with chemical properties of the nanofiller.
Keywords :
curing; filled polymers; graphene; heat treatment; materials preparation; nanocomposites; nanofabrication; permittivity; resins; CO; chemically modified graphene oxide; conductive graphene; dielectric properties; epoxy resin; neat epoxy; permittivity; polymer nanocomposites; postcuring heating; Chemicals; Dielectrics; Dispersion; Graphene; Nanocomposites; Permittivity; Polymers; graphene; graphene oxide reduction; nanodielectric; naocomposites; permittvity change;
Conference_Titel :
Solid Dielectrics (ICSD), 2013 IEEE International Conference on
Conference_Location :
Bologna
Print_ISBN :
978-1-4799-0807-3
DOI :
10.1109/ICSD.2013.6619697
