Title :
PVMaT technology improvements in the EFG high volume PV manufacturing line
Author :
Rosenblum, M.D. ; Bathey, B.R. ; Cao, J. ; Gonsiorawski, R. ; Mackintosh, B.H. ; Southimath, S.B. ; Doedderlein, J.M. ; Kalejs, J.P.
Author_Institution :
ASE Americas Inc., Billerica, MA, USA
Abstract :
We report here on advances made in EFG technology over a 3-year PVMaT 5A2 NREL subcontract. We describe improvements to lower module costs through raising cell efficiencies to 14% and reduction of mechanical and electrical losses. Plasma etching of the laser-cut wafer edges has reduced acid use by >50%. We have introduced 10 cm × 15 cm wafers into manufacturing, and a larger diameter EFG furnace for producing 12.5 × 12.5 cm wafers has been designed and is in pilot testing. Module encapsulation materials and designs have been improved. This work has been accomplished while simultaneously ramping up to 20 MW in wafer production.
Keywords :
crystal growth from melt; photovoltaic cells; semiconductor device manufacture; semiconductor growth; solar cells; sputter etching; 10 cm; 12.5 cm; 14 percent; 15 cm; 20 MW; EFG high volume PV manufacturing line; PVMaT technology improvements; electrical losses; laser-cut wafer edges; lower module costs; mechanical losses; module encapsulation materials; plasma etching; raising cell efficiencies; Costs; Encapsulation; Etching; Furnaces; Manufacturing; Optical materials; Plasma applications; Plasma materials processing; Subcontracting; Testing;
Conference_Titel :
Photovoltaic Specialists Conference, 2002. Conference Record of the Twenty-Ninth IEEE
Print_ISBN :
0-7803-7471-1
DOI :
10.1109/PVSC.2002.1190455
