Title :
Measurement and optimisation of bond strength for anodic bonding of glass to dielectric thin films
Author :
Cummins, G. ; Lin, H. ; Walton, A.J.
Author_Institution :
Inst. of Micro & Nano Syst. Inst. of Integrated Syst., Univ. of Edinburgh, Edinburgh
Abstract :
This paper details the optimization and characterization of an anodic bonding process for glass to dielectric thin films. Test structures suitable for non destructive, in-situ measurement of the bond strength at the interface have been used to determine the uniformity and quality of the bond.
Keywords :
bonding processes; dielectric thin films; anodic bonding; bond strength optimisation; dielectric thin films; in-situ measurement; Bonding processes; Dielectric measurements; Dielectric thin films; Electrostatics; Glass; Silicon; Temperature; Testing; Titanium; Wafer bonding;
Conference_Titel :
Microelectronic Test Structures, 2008. ICMTS 2008. IEEE International Conference on
Conference_Location :
Edinburgh
Print_ISBN :
978-1-4244-1800-8
Electronic_ISBN :
978-1-4244-1801-5
DOI :
10.1109/ICMTS.2008.4509324
