DocumentCode :
3340725
Title :
Advances in high throughput wafer and solar cell technology for EFG ribbon
Author :
Kalejs, J. ; Mackintosh, B. ; Schmidt, Werner ; Woesten, B.
Author_Institution :
ASE Americas Inc., Billerica, MA, USA
fYear :
2002
fDate :
19-24 May 2002
Firstpage :
74
Lastpage :
77
Abstract :
Construction of as many as 70 × 100 MW manufacturing facilities in the next two decades is required to address U.S. Photovoltaic Industry Roadmap targets. Effective material utilization, high throughput and yield, improvements in solar cell efficiency, and minimizing the environmental impact of manufacturing waste products are all desirable attributes that must be combined in low cost factory equipment. We discuss how these elements are being addressed with ribbon technology now under development for crystalline silicon wafer production by the Edge-defined Film-fed Growth (EFG) method.
Keywords :
crystal growth from melt; elemental semiconductors; semiconductor device manufacture; semiconductor growth; silicon; solar cells; 100 MW; EFG ribbon; Si; edge-defined film-fed growth method; effective material utilization; environmental impact; high throughput wafer technology; low cost factory equipment; manufacturing waste products; solar cell efficiency; solar cell technology; Construction industry; Costs; Crystalline materials; Manufacturing industries; Photovoltaic cells; Photovoltaic systems; Production facilities; Solar power generation; Throughput; Waste materials;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Photovoltaic Specialists Conference, 2002. Conference Record of the Twenty-Ninth IEEE
ISSN :
1060-8371
Print_ISBN :
0-7803-7471-1
Type :
conf
DOI :
10.1109/PVSC.2002.1190459
Filename :
1190459
Link To Document :
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