2.6-GHz RF inductive power delivery for contactless on-wafer characterization

This paper presents the critical components of a contactless IC testing infrastructure to power on-chip characterization circuits. This includes an inductively-coupled, contactless power delivery system implemented on a 90 nm CMOS technology using 150 mum times 150 mum on-chip and off-chip spiral inductors, low loss rectifiers and on-chip voltage regulators to create a constant and repeatable 1-V, 8.5-mW DC source. We present the measured process variation of ring oscillator test circuits in contrast to the on-chip voltage source variation to demonstrate the feasibility of process variation analysis using this system.