DocumentCode :
3340960
Title :
Effect of initiator nature on ionic conduction in radiation cured epoxies
Author :
Vissouvanadin, B. ; Roy, S. ; Teyssedre, Gilbert ; Laurent, C. ; Ranoux, G. ; Coqueret, X.
Author_Institution :
Lab. Plasma et Conversion d´Energie, Univ. de Toulouse, Toulouse, France
fYear :
2013
fDate :
June 30 2013-July 4 2013
Firstpage :
27
Lastpage :
30
Abstract :
Radiation-cured epoxy networks are promising materials for a number of applications for which both high mechanical and dielectric strength are required. In this work, epoxy materials are manufactured via a cationic mechanism which requires an initiator, generally an onium salt, to trigger the cross-linking process under ionizing radiation. It has been established that both the nature of initiator and its content have an impact on the network properties in terms of thermal and mechanical behaviour. We show in this contribution that the increase in chain mobility (decrease in Tg) along with the presence of residual ions results in space charge polarization, increasing both dielectric permittivity and losses under low frequency AC field. This effect also promotes build-up of heterocharges at moderate DC field.
Keywords :
curing; electric strength; ionic conductivity; ionisation; mechanical strength; permittivity; positive ions; resins; DC field; cationic mechanism; chain mobility; cross-linking process; dielectric permittivity; dielectric strength; epoxy material; initiator nature; ionic conduction; ionizing radiation; mechanical behaviour; mechanical strength; onium salt; radiation-cured epoxy networks; residual ions; space charge polarization; thermal behaviour; Dielectrics; Permittivity; Polymers; Space charge; Temperature distribution; Temperature measurement; Radiation curing; carrier mobility; epoxy; initiator; space charge polarization;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid Dielectrics (ICSD), 2013 IEEE International Conference on
Conference_Location :
Bologna
ISSN :
2159-1687
Print_ISBN :
978-1-4799-0807-3
Type :
conf
DOI :
10.1109/ICSD.2013.6619722
Filename :
6619722
Link To Document :
بازگشت