DocumentCode
3341031
Title
Physics and modeling of transistor matching degradation under matched external stress
Author
Wu, Xiaoju ; Chen, Zhenwu ; Madhani, Praful
Author_Institution
Analog Technol. Dev., Dallas, TX
fYear
2008
fDate
24-27 March 2008
Firstpage
233
Lastpage
237
Abstract
In this paper, we report detailed studies on transistor matching reliability under external stresses such as NBTI. Transistor threshold voltage VT mismatching as a function of stress voltage, ambient temperature as well as stress time has been established based on device physics and statistics. A closed form equation for current mismatching under stress has also been obtained using a correlated mobility-shift and VT-shift model. Methods to extract relevant parameters in the models have been established. The models have been validated experimentally and been used to predict the transistor matching shift under normal operating conditions for a 40 V high performance precision analog technology. It has been found that transistor matching degrades ~10% during the 10 years lifetime of products when operating at VGS=15 V and 100 C. This suggests -10% over design for critical matched transistors at time zero in order to achieve a 10 year reliability requirement.
Keywords
semiconductor device models; semiconductor device reliability; transistors; VT-shift model; ambient temperature; closed form equation; correlated mobility-shift model; high performance precision analog technology; stress time; threshold voltage; transistor matching reliability; voltage 40 V; Degradation; Equations; Niobium compounds; Physics; Predictive models; Statistics; Stress; Temperature distribution; Threshold voltage; Titanium compounds;
fLanguage
English
Publisher
ieee
Conference_Titel
Microelectronic Test Structures, 2008. ICMTS 2008. IEEE International Conference on
Conference_Location
Edinburgh
Print_ISBN
978-1-4244-1800-8
Electronic_ISBN
978-1-4244-1801-5
Type
conf
DOI
10.1109/ICMTS.2008.4509344
Filename
4509344
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