• DocumentCode
    3341348
  • Title

    An Electro-Aerodynamic Solid-State Fan and Cooling System

  • Author

    Schlitz, Dan ; Singhal, Vishal

  • Author_Institution
    Thorrn Micro Technol., Inc., Arlington, VA
  • fYear
    2008
  • fDate
    16-20 March 2008
  • Firstpage
    46
  • Lastpage
    49
  • Abstract
    A miniature solid-state fan has been developed. The solid-state fan blows air like a typical rotary fan but without any moving parts. It uses the principle of electro- aerodynamic pumping. These fans have been shown to produce a pressure head of up to 42 Pa. Operable fans as small as 1 mm thick have been demonstrated. These fans are intended to provide air flow to cool a 20 Watt chip in an integrated, chip-scale cooling system or to replace the blower in a laptop cooling system.
  • Keywords
    aerodynamics; chip scale packaging; cooling; pumps; chip-scale cooling system; cooling system; electro-aerodynamic pumping; solid-state fan; Cooling; Corona; Electric breakdown; Electrodes; Fans; Geometry; Solid state circuits; Technological innovation; Voltage; Wire; Corona discharge; Corona wind; Electric wind; Electrostatic blower; Ionic wind;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Thermal Measurement and Management Symposium, 2008. Semi-Therm 2008. Twenty-fourth Annual IEEE
  • Conference_Location
    San Jose, CA
  • ISSN
    1065-2221
  • Print_ISBN
    978-1-4244-2123-7
  • Electronic_ISBN
    1065-2221
  • Type

    conf

  • DOI
    10.1109/STHERM.2008.4509364
  • Filename
    4509364