Title :
Transient Thermal Imaging Using Thermoreflectance
Author :
Maize, K. ; Christofferson ; Shakouri, A.
Author_Institution :
Jack Baskin Sch. of Eng., Univ. of California, Santa Cruz, CA
Abstract :
Lock-in thermoreflectance imaging has proven effective in obtaining thermal images of active electronic and optoelectronic devices with submicron spatial resolution and 10- 50 mK temperature resolution. Thermoreflectance systems that use a lock-in method capture the steady state thermal signal but provide limited information about the thermal transient. We present a simple time series thermoreflectance method based on pulsed box-car averaging and a novel differencing technique to obtain transient thermal images with millisecond and microsecond time resolution and submicron spatial resolution. The technique relies on precise adjustment of the phase between the pulsed thermal excitation of the device and the illumination pulse used to measure the thermoreflectance change on the device. The full thermal transient pattern is reconstructed and captured in a charge coupled device (CCD) camera in a matter of minutes. Images are presented of the time evolution of the thermal signals on 40times40, and 100times100 micron square gold heaters.
Keywords :
charge-coupled devices; image reconstruction; image resolution; infrared imaging; semiconductor devices; thermoreflectance; CCD camera; active electronic devices; charge coupled device camera; optoelectronic devices; pulsed box-car averaging; pulsed thermal excitation; steady state thermal signal; submicron spatial resolution; temperature 10 mK to 50 mK; thermoreflectance imaging; transient thermal imaging; Charge-coupled image sensors; Image resolution; Lighting; Optoelectronic devices; Pulse measurements; Signal resolution; Spatial resolution; Steady-state; Temperature; Thermoreflectance imaging; Thermoflectance imaging; temperature; thermal; transcient;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 2008. Semi-Therm 2008. Twenty-fourth Annual IEEE
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-4244-2123-7
Electronic_ISBN :
1065-2221
DOI :
10.1109/STHERM.2008.4509366