• DocumentCode
    3341586
  • Title

    The influence of thin dielectric coatings on LI and AC breakdown strength in SF6 and dry air

  • Author

    van der Born, D. ; Morshuis, P.H.F. ; Smit, J.J. ; Girodet, Alain

  • Author_Institution
    Intell. Electr. Power Grids, Delft Univ. of Technol., Delft, Netherlands
  • fYear
    2013
  • fDate
    June 30 2013-July 4 2013
  • Firstpage
    287
  • Lastpage
    290
  • Abstract
    Electric power consumption has increased over the years while the available space for substations has become smaller. Newly designed gas insulated switchgears (GIS) have to be smaller and have to operate at a higher system voltage. Furthermore, the urge to decrease the use of SF6 as an insulating gas in GIS is becoming larger because of the high production and handling costs and the high global warming potential. Unfortunately, the breakdown strength of alternative gases is usually lower than that of SF6. However, with the application of a coating on the electrodes in GIS the breakdown strength can be improved. In this paper, the performance of GIS with thin coatings is evaluated with breakdown tests. The test setup consists of a rodplane electrode arrangement with a coated rod electrode. The coatings vary in thickness between 40 micrometers and 2 millimeters. The breakdown tests are performed at either 50 Hz AC or lightning impulse voltage.
  • Keywords
    coatings; gas insulated switchgear; substation protection; AC breakdown strength; GIS; SF6; alternative gases; breakdown strength; coated rod electrode; dry air; electric power consumption; electrodes coating; gas insulated switchgears; global warming potential; lightning impulse voltage; rodplane electrode; substations; thin dielectric coatings; Breakdown voltage; Coatings; Electric breakdown; Electrodes; Lightning; Sulfur hexafluoride; Surface treatment; AC; GIS; SF6; breakdown strength; dry air; lightning impulse; thin coating;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid Dielectrics (ICSD), 2013 IEEE International Conference on
  • Conference_Location
    Bologna
  • ISSN
    2159-1687
  • Print_ISBN
    978-1-4799-0807-3
  • Type

    conf

  • DOI
    10.1109/ICSD.2013.6619752
  • Filename
    6619752