Design considerations for surface mountable DC-DC converters

Author

O´Driscoll, Seamus ; McDermott, Bernard

Author_Institution

Artesyn Technol., Cork, Ireland

Volume

1

fYear

1999

fDate

14-18 Mar 1999

Firstpage

318

Abstract

The key contender packaging systems for high specification surface mountable (SMT) DC-DC power converters are reviewed. Various substrate, leadout and encasing options are examined for reliability and true surface mountability. Both open-frame and moulded designs are studied. Thermal performance comparison data are presented. Mechanical performance criteria, evaluating the power converter as an SMT component are outlined. Manufacturing and end-user process issues are discussed. Electrical design caveats are outlined

Keywords

DC-DC power convertors; circuit reliability; surface mount technology; thermal analysis; SMT component; electrical design caveats; encasing options; leadout options; mechanical performance criteria; moulded designs; open-frame designs; packaging systems; reliability; substrate options; surface mountable DC-DC power converters; thermal performance; Calibration; Circuit testing; DC-DC power converters; Electrical resistance measurement; Ferrites; Packaging; Plastics; Silicon; Surface-mount technology; System testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Applied Power Electronics Conference and Exposition, 1999. APEC '99. Fourteenth Annual

Conference_Location

Dallas, TX

Print_ISBN

0-7803-5160-6

Type

conf

DOI

10.1109/APEC.1999.749668

Filename

749668