DocumentCode
3342240
Title
Passivation property of SiNx:H/SiO2 double layer formed by ammonia microwave remote plasma CVD method
Author
Fushimi, Y. ; Wake, T. ; Fujiwara, M. ; Saitoh, T. ; Kamisako, K.
Author_Institution
Fac. of Technol., Tokyo Univ. of Agric. & Technol., Japan
fYear
2002
fDate
19-24 May 2002
Firstpage
375
Lastpage
378
Abstract
We evaluated the passivation property of SiNx:H/SiO2 double layers formed at various temperatures by using hydrogen radical annealing. The passivation property was analyzed by measuring effective lifetime and interface state density. The effective lifetime and the interface state density depended strongly on the deposition temperature of SiNx:H layers. The effect of hydrogen radical annealing for SiNx:H/SiO2 double layer´s was weakened with an increase in deposition temperature of SiNx:H. It was speculated that the annealing effect depending on deposition temperature was caused during deposition. At the deposition temperature of 350°C, the annealing effect during deposition was nearly equal to the hydrogen radical annealing effect after the deposition. The annealing with ammonia afterglow plasma improved effectively the effective lifetime in SiO2/c-Si single layers. When the deposition time is chosen, the annealing effect should be taken into consideration.
Keywords
ammonia; annealing; hydrogen; passivation; plasma CVD coatings; silicon; silicon compounds; solar cells; 350 degC; NH3; SiNx:H-SiO2; SiNx:H/SiO2 double layer; SiO2-Si; SiO2/c-Si single layers; ammonia afterglow plasma; ammonia microwave remote plasma CVD method; deposition temperature; effective lifetime; hydrogen radical annealing; hydrogen radical annealing effect; interface state density; passivation; Annealing; Density measurement; Hydrogen; Interface states; Microwave theory and techniques; Passivation; Plasma measurements; Plasma properties; Plasma temperature; Silicon compounds;
fLanguage
English
Publisher
ieee
Conference_Titel
Photovoltaic Specialists Conference, 2002. Conference Record of the Twenty-Ninth IEEE
ISSN
1060-8371
Print_ISBN
0-7803-7471-1
Type
conf
DOI
10.1109/PVSC.2002.1190537
Filename
1190537
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