DocumentCode
3342367
Title
Tracking and erosion resistance of silicone rubber/BN nanocomposites under DC voltage
Author
Hang Xu ; Du, B. ; Zhonglei Li ; Yong Liu ; Yunpeng Li
Author_Institution
Sch. of Electr. Eng. & Autom., Tianjin Univ., Tianjin, China
fYear
2013
fDate
June 30 2013-July 4 2013
Firstpage
218
Lastpage
221
Abstract
Silicon rubber is widely employed as insulating materials in transmission lines due to its excellent electrical and mechanical properties. The discharges that happen inevitably during the operation of the composite insulators release too much heat that can cause electrical erosion on the surface of silicon rubber (SiR) insulators. It is known that the aim of improving the resistance to tracking and erosion of silicon rubber can be achieved by increasing its thermal conduction ability. In this study, samples were prepared by dispersing nano-BN particles into silicone rubber at concentrations of 0%, 2.5%, 5% by weight. According to IEC 60587, Inclined plane (IP) tracking and erosion tests were conducted to compare the phenomena occurring during the tests. The experimental results suggest that with the increase in concentration of nano-BN fillers from 0 wt% to 5 wt%, the thermal properties are improved. In addition, the erosion depth and the weight loss show a decreasing trend which proves that the resistance of silicon rubber to tracking and erosion is improved.
Keywords
composite insulators; erosion; heat conduction; insulator testing; nanocomposites; nanoparticles; silicone rubber; silicone rubber insulators; BN nanocomposites; DC voltage; IEC 60587; IP tracking; SiR insulators; composite insulators; electrical erosion; electrical property; erosion depth; erosion resistance; erosion tests; inclined plane tracking; insulating materials; mechanical property; nanoBN filler concentration; nanoBN particles; power transmission lines; silicone rubber tracking; thermal conduction ability; thermal properties; weight loss; Degradation; Heating; Insulation life; Nanocomposites; Resistance; Rubber; Thermal conductivity; BN; Silicone rubber; inclined plane test; nanocomposite; thermal conduction; tracking and erosion resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid Dielectrics (ICSD), 2013 IEEE International Conference on
Conference_Location
Bologna
ISSN
2159-1687
Print_ISBN
978-1-4799-0807-3
Type
conf
DOI
10.1109/ICSD.2013.6619791
Filename
6619791
Link To Document