DocumentCode
3342388
Title
Comparison of two charge packet models under dc electric fields
Author
Chen, Gang ; Yutian Wang
Author_Institution
Tony Davies High Voltage Lab., Univ. of Southampton, Southampton, UK
fYear
2013
fDate
June 30 2013-July 4 2013
Firstpage
931
Lastpage
934
Abstract
Charge packet under high electric dc fields has been observed in polyethylene and its formation has been closely associated with ageing and breakdown of the insulating material. To understand the mechanisms several models have been proposed. In this paper, two models originated from completely different approaches have been reviewed. The first model proposed is based on bipolar charge injection together with electric field dependent mobility. It has been found that the negative differential mobility with the electric field is essential for the formation of charge packet. On the other hand, the second model considers the change in conductivity after charge injection. By assigning different conductivities to two different zones it is possible to form a charge packet that bears some similarity with the observed features. Simulations based on these two models have been carried out and both dynamics of charge packet and resultant current in the two models are compared and discussed.
Keywords
ageing; electric breakdown; polyethylene insulation; space charge; DC electric field; ageing; bipolar charge injection; breakdown; charge packet dynamics; charge packet formation; charge packet model; electric field-dependent mobility; insulating material; negative differential mobility; polyethylene; second model; Charge carrier processes; Conductivity; Electric fields; Equations; Materials; Mathematical model; Numerical models; Space charge; charge packet; numerical modeling; polymeric materials;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid Dielectrics (ICSD), 2013 IEEE International Conference on
Conference_Location
Bologna
ISSN
2159-1687
Print_ISBN
978-1-4799-0807-3
Type
conf
DOI
10.1109/ICSD.2013.6619793
Filename
6619793
Link To Document