• DocumentCode
    3342628
  • Title

    Approaches to Improving Reliability in e-Engineering Framework

  • Author

    Kuk, Seung Hak ; Kim, Hyeon Soo ; Lee, Jai-Kyung ; Park, Seong-Whan

  • Author_Institution
    Dept. of Comput. Sci. & Eng., Chungnam Nat. Univ., Daejeon
  • fYear
    2008
  • fDate
    23-26 Sept. 2008
  • Firstpage
    353
  • Lastpage
    360
  • Abstract
    In order to improve productivity and quality of the products, there are many efforts to integrate and automate design/analysis processes based on various distributed engineering resources. KIMM (Korea Institute of Machinery and Materials) constructed SOA (Service Oriented Architecture)-based e-Engineering framework for flexible integration and automation of the engineering processes on the Web services environment. However, guaranteeing reliability in the engineering process is one of the new problems that must be solved in the e-Engineering framework. This paper presents two approaches to handle various exceptions that happen in the middle of the execution of the process. One is to introduce recovery activities into the engineering process modeling to handle exceptions caused by failures of the engineering resources; the other is to use log-based recovery techniques to recover from the system exceptions such as network failures or system crashes.
  • Keywords
    Web services; product design; productivity; software architecture; software reliability; Web services; distributed engineering resources; e-engineering framework; log-based recovery techniques; product quality; productivity; reliability; service oriented architecture; Computer crashes; Design engineering; Machinery; Mechanical engineering; Network servers; Productivity; Reliability engineering; Service oriented architecture; Simple object access protocol; Web services; Reliability; SOA (Service Oriented Architecture); Web Services; e-Engineering framework;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Web Services, 2008. ICWS '08. IEEE International Conference on
  • Conference_Location
    Beijing
  • Print_ISBN
    978-0-7695-3310-0
  • Electronic_ISBN
    978-0-7695-3310-0
  • Type

    conf

  • DOI
    10.1109/ICWS.2008.109
  • Filename
    4670195