DocumentCode :
3342630
Title :
The breakdown strength and localised structure of polystyrene as a function of nanosilica fill-fraction
Author :
Praeger, M. ; Vaughan, A.S. ; Swingler, S.G.
Author_Institution :
Tony Davies High Voltage Lab., Univ. of Southampton, Southampton, UK
fYear :
2013
fDate :
June 30 2013-July 4 2013
Firstpage :
863
Lastpage :
866
Abstract :
In this work the amorphous matrix of polystyrene provides a homogenous basis into which nanosilica particles are added. Composites are made with four different types of nanosilica particles which are subsequently compared. The DC breakdown strength of the resulting nanocomposite materials is measured as a function of filler fraction with loadings between 0 and 10 %. One advantage of using a polystyrene matrix for this study is its compatibility with permanganic etching. This technique is used to remove part of the polystyrene matrix and render the configuration of the nanofiller particles within the composite amenable to examination by scanning electron microscope (SEM). The simple sample preparation protocol employed here resulted in significant nanofiller agglomeration and the DC breakdown strength was found to decrease with increasing filler fraction.
Keywords :
dielectric materials; electric breakdown; etching; nanocomposites; nanoparticles; scanning electron microscopy; DC breakdown strength; SEM; amorphous matrix; filler fraction function; localised structure; nanocomposite materials; nanofiller agglomeration; nanofiller particles; nanosilica fill-fraction; nanosilica particles; permanganic etching; polystyrene matrix; sample preparation protocol; scanning electron microscope; Dielectrics; Electric breakdown; Etching; Loading; Plastics; Silicon compounds; SEM; breakdown; composite; dielectric; nano; permanganic; polystyrene; silica;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid Dielectrics (ICSD), 2013 IEEE International Conference on
Conference_Location :
Bologna
ISSN :
2159-1687
Print_ISBN :
978-1-4799-0807-3
Type :
conf
DOI :
10.1109/ICSD.2013.6619807
Filename :
6619807
Link To Document :
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